Latest Semiconductor News Released on June 18 to 24, 2023

OIF Launches advanced Energy Efficient Interfaces (EEI) Framework

On June 23, 2023, OIF announced the launch of an innovative new project - the Energy Efficiency Interfaces (EEI) Framework. It will focus on new energy-efficient electrical and optical interfaces (which include next-generation low-power optics, also known as "linear" or "direct drive") . And these new interfaces will need to meet the needs of various applications such as data center networking, artificial intelligence (AI) training/machine learning (ML) and disaggregation.

India-US Semiconductor Cooperation is deepening

The United States and India will announce a series of defense and technology cooperation on Thursday during the state visit, U.S. officials said.

As Indian President Narendra Modi is on a visit with U.S. President Joe Biden, Micron confirmed plans to build a DRAM and NAND assembly and testing plant in Gujarat state, India. The facility will produce DRAM and NAND wafers, ball grid array (BGA) ICs, memory modules and solid-state drives.

AMD to increase investment in FPGA

AMD today announced plans to invest up to $135 million over four years in continued growth in Ireland. It aims to fund a number of strategic research and development projects by adding up to 290 highly skilled engineering and research positions, as well as a wide range of additional support roles.

Intel agrees to sell minority stake in IMS nanofabrication

Intel announced today that it has agreed to sell approximately 20% stake in IMS Nanofabrication GmbH (“IMS”) to Bain Capital Special Situations. The transaction is expected to close in the third quarter of 2023. IMS will operate as an independent subsidiary and continue to be led by CEO, Elmar Platzgummer.

Broadcom announces availability of second-gen Wi-Fi 7

Broadcom has announced sample availability of its second-generation of wireless connectivity chipset solutions for the Wi-Fi 7 ecosystem to address cost-effectiveness and enable competitive parity. It also said that since samples of the new chip are already underway, and more attractively priced Wi-Fi 7 products within a few quarters will be in the market.

Intel and CEA-Leti to develop 2D TMDs on 300-mm wafers

Intel and CEA-Leti today announced a joint research project to develop layer transfer technology for two-dimensional transition metal dichalcogenides (2D TMDs) on 300mm wafers, with the goal of extending Moore's Law beyond 2030.

Two-dimensional layered semiconductors, such as molybdenum- and tungsten-based TMDs, promise to extend Moore's Law and ensure eventual scaling of MOSFET transistors, as 2D-FETs offer inherent sub-1nm transistor channel thicknesses. Due to their good carrier transport and mobility, even for atomically thin layers, they are good for high-performance and low-power platforms. Furthermore, their device body thickness and modest energy bandgap lead to enhanced electrostatic control, resulting in low off-state current.

Intel spends $33 billion in Germany in landmark expansion

Intel will spend more than 30 billion euros ($33 billion) to build two chip manufacturing plants in Magdeburg as part of its European expansion plans. German Chancellor Olaf Scholz agreed with Intel on Monday, and this cooperation is also hailed as the largest foreign investment in Germany's history.

Berlin has agreed to give Intel nearly 10 billion euros worth of subsidies, up from the 6.8 billion euros it originally offered the company to build two cutting-edge facilities in the eastern city, a person familiar with the matter said.

Intel to invest $25 billion in Israel chip plant upgrade

The Times of Israel reported that US semiconductor giant Intel has signed an agreement in principle with the government to invest $25 bln in building a chip manufacturing plant in Kiryat Gat.

Israeli Prime Minister Benjamin Netanyahu said Intel's investment is "unprecedented" in Israel and will be used to build a chip manufacturing plant using the world's most advanced technology. In 2019, Intel has negotiated to invest about $10 billion in the Kiryat Gat chip factory.

ASML says decoupling chip supply chain is practically impossible

According to Nikkei Asia, Christophe Fouquet, executive vice president and chief business officer of ASML, said that the decoupling of the global semiconductor supply chain is impossible, it will be extremely difficult and expensive, and it will be difficult for any country to establish its own completely self-reliant chip industry.

“It's only a matter of time before people realize that the only way to succeed in semiconductors is to cooperate.” Fouquet said.

Intel reorganized its manufacturing business

Intel announced on Wednesday (21st) that it will reorganize its wafer foundry business (IFS) and that it will operate independently and generate profits in the future, but it did not give a clear timetable for mass production, nor did it mention which manufacturer will become a major customer of OEM services. After that, Intel closed down 6 percent, its biggest one-day drop since January.

Google seeks suppliers to move some Pixel production to India

Google is looking for suppliers in India to assemble its Pixel smartphones, in a move to take a page from Apple's diversification of its supply chain outside mainland China.

According to Taiwan media Electronic Times, this global tech giants has started preliminary negotiations with local companies such as Lava, Dixon and Bharat FIH, a subsidiary of Foxconn in India.

Govt-Backed JIC plans to acquire JSR with 1-T.-Yen

The goverment-backed company Japan Investment Corporation (JIC) is in talks to acquire JSR, a photoresist maker, for 1 trillion yen, Nikkei reported. The preliminary acquisition intentions has made as early as this year. If all goes well, JSR could be delisted from the Tokyo Stock Exchange in 2024.

Nvidia's order line up to 2024

Most companies with cloud-related businesses this year have purchased a large number of GPUs from Nvidia, and the company's orders have been scheduled until 2024.

Benefiting from the surge in global computing demand, GPU orders are increasing. So GPU prices have soared, with prices up nearly 50% so far in March. In addition, with the rapid development of generative AI and robot learning, the market demand for GPU is expected to continue to rise.

ROHM and Vitesco Technologies sign a long-term SiC supply agreement

ROHM Semiconductor and Vitesco Technologies announced today that they have formed a long-term silicon carbide (SiC) supply partnership worth over US$1 billion (2024-2030) .

Vitesco Technologies' advanced inverters based on ROHM SiC chips will be adopted by two customers for electric vehicle powertrains. Vitesco will begin supplying the first series project as early as 2024, earlier than originally set timeline.