2023 Latest Semiconductor News Update on Monday

Netherlands published new chip equipment export controls

The Netherlands on Friday announced that additional export control measures for advanced semiconductor manufacturing equipment will come into effect on September 1, 2023. So there is need national authorization requirements to export chip devices that stipulated in the document.

In addition to EUV lithography machines and more advanced DUV lithography machines, the Netherlands also includes ALD equipment and some SiC epitaxial equipment.

Oracle unveils a generative AI cloud service

Oracle founder and chairman, Larry Ellison, recently revealed that the company intends to expand into the nascent field of cloud-based generative artificial intelligence. The move requires Nvidia GPUs and a large budget for chip purchases.

That is, the company will spend billions of dollars on Nvidia GPUs this year alone due to growing demand for AI-based products that require significant hardware and financial investments for training and content delivery.

Imec, ASML further collaborate on EUV lithography project

ASML will install a full set of state-of-the-art tools in Imec's clean room to support the development of sub-2nm process technology. The pilot line in Leuven will include the latest model of high numerical aperture scanner, the latest model of 0.33 numerical aperture EUV and DUV immersion systems, and the Yieldstar optical and HMI multifunctional system - Beam Metrology Tools.

Luc Van den hove commented: "This commitment from ASML builds on more than 30 years of successful collaboration and sends a strong signal of our unwavering commitment to advancing sub-nanometer chip technology." Because ASML has been collaborating with IMEC on advanced lithography processes for many years. 

AMD introduces largest FPGA-based adaptive SoC

AMD has a new giant FPGA. The AMD VP1902 will be the largest FPGA in the world. Such FPGAs are designed to provide huge arrays of programmable logic specifically designed to emulate the silicon designs of future chips, ranging from small SoCs in the Raspberry Pi to large next-generation accelerators like the AMD Instinct MI300.

The previous generation Xilinx VU19P was the largest FPGA at one time, but the new VP1902 adds Versal capabilities and uses a new AMD chiplet design, more than doubling the key FPGA functions.

Samsung Foundry roadmap: 2nm chips in 2025, 1.4nm in 2027

Samsung officially announced the latest chip manufacturing process roadmap and business strategy at the 7th Samsung Foundry Forum (SFF) on June 27, saying that it will mass-produce 2nm process chips in 2025 and 1.4nm in 2027. More than 700 Samsung customers and partners participated in this forum. The company said that GAA advanced node technology will play an important role in supporting customers to develop artificial intelligence.