Canon prepares nanoimprint lithography tool to challenge ASML
Canon has launched the FPA-1200NZ2C nanoimprint lithography system, an alternative technology to extreme ultraviolet lithography (EUV) that promises to revolutionize the industry. This significant advance, achieved after years of intensive research and development, marks a critical step forward in semiconductor manufacturing.
The current most advanced technology meets the 5nm process requirements, and the next step will be to break through to 2nm. This move by Canon expands its lineup of semiconductor manufacturing equipment to meet a wide range of user needs, from advanced semiconductor equipment to more traditional semiconductor equipment.
Samsung unveils Shinebolt HBM3E memory
Samsung unveiled its HBM3E memory called Shinebolt during its Memory Tech Days 2023 event. It is based on new 24Gbit HBM memory chips, and produced by D1a process, which is the company's fourth-generation EUV-based 10nm-class (14nm) node. Samsung will produce 8Hi and eventually 12Hi stacks based on this new chip, with total stack capacities of 24GB and 36GB respectively, 50% higher than HBM3 (Icebolt) related products.
Qualcomm and Google team up for RISC-V based wearables
Qualcomm announced today that they will build on their long-term cooperation with Google to launch a RISC-V based wearable device solution for use with Wear OS. This expanded framework will help pave the way for more products within the ecosystem to take advantage of low-power and high-performance custom CPUs.
Until then, the two companies will continue to invest in the Snapdragon Wear platform as the leading smartwatch chip provider for the Wear OS ecosystem.
UK details fund for chip startups as part of semi strategy
The UK government has announced the ChipStart program as part of its national semiconductor strategy, which will see a dozen silicon startups share £1.3 million ($1.58 million) in funding.
ChipStart is designed to provide early-stage companies involved in semiconductor design with the technical and commercial assistance they need to bring new products to market, DSIT said. Twelve companies are expected to participate, which includes access to custom chip design tools, business expertise, professional mentorship and opportunities to network with potential investors and partners.
China announces export control on certain graphite materials, products
Under the new measures, China will require exporters to apply for permits to certain highly sensitive graphite items, effective from December 1. In an announcement jointly issued by the Ministry of Commerce (MOC) and the General Administration of Customs mentioned that items that meet the following characteristics may not be exported without permission: (1) High purity (purity >99.9 %), high strength (flexural strength>30Mpa), high density (density>1.73g/cubic centimeter) artificial graphite materials and their products; (2) Natural flake graphite and its products (including spheroidized graphite, expanded graphite, etc.).
Meanwhile, natural flake graphite and its products, including spheroidized graphite and expanded graphite, will also be banned from export unless there is permission, according to the announcement.
India allows restriction-free imports of laptops, tablets in policy
The Indian government has announced that it will allow unrestricted imports of laptops and tablets, as part of a new import management. It takes effect from November 1, requiring companies to register the quantity and value of imports and will use these data for monitoring, but the government will not refuse any import requests.
KKR-backed Kokusai Electric's IPO becomes Japan's largest in five years
Chip equipment maker Kokusai Electric raised $724.4 million after pricing its shares at the high end of the market range in Japan's biggest initial public offering in five years.
Kokusai, a unit of U.S. private equity firm KKR.N, priced its IPO at 1,840 yen per share, valuing the company at 423.9 billion yen ($2.8 billion), according to a filing on Monday. KKR's partial exit will see its stake fall from 73.2% to 47.7% (excluding potential over-allotments). The shares are scheduled to list on the Tokyo Stock Exchange's main market on October 25.
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