Latest Semiconductor News Update on Jan 7 to 13, 2024

HPE to buy Juniper Networks in $14 billion all-cash deal

Hewlett Packard Enterprise officially announced Tuesday its intent to acquire Juniper Networks in a deal valued at $14 billion. HPE said in a statement that it expects to close the transaction in late 2024 or early 2025. The news comes a day after The Wall Street Journal reported that the two companies were in late-stage talks. 

Juniper originally focused on data center routing when it was founded in 1996, just as the enterprise Internet was beginning to explode, and Pradeep Sindhu created a way to enable routers to handle data packets rather than just voice circuits. Over decades, Juniper has created routing and switching hardware as well as network operating systems, software-defined switching applications and security products and accumulated a wealth of intellectual property.

SamrtSens has launched its first 50 MP 1/1.28-inch image sensor SC580XS

SmartSens unveils SC580XS, a 50MP smartphone camera sensor with advanced HDR, low noise, high frame rate 4K video, and energy efficiency. This new product is an upgraded product built on the same process of the first 50-megapixel 1/1.56-inch product SC550XS using the 22nm HKMG Stack process. SC580XS is equipped with the new generation pixel technology SFCPixel®-2 as well as PixGain HDR®, AllPix ADAF® and many other technologies and processes. It features high dynamic range, low noise, 100% full pixel focus, performance advantages such as ultra-low power consumption bring excellent quality images to the main camera of flagship smartphones.

Cadence acquires Invecas to accelerate system realization

Cadence announced it has acquired Invecas, Inc., a leading provider of design engineering, embedded software and system-level solutions. The move adds a highly skilled system design engineering team to Cadence with expertise in delivering custom solutions to customers across silicon design, product engineering, advanced packaging and embedded software.

The acquisition brings with it a highly skilled Hyderabad-centric engineering team, led by Invecas CEO Dasaradha Gude, who has extensive experience in delivering end-to-end system solutions with expertise in advanced nodes, mixed-signal , verification, embedded software, packaging and turnkey areas with deep expertise in custom silicon production. Invecas has developed strong relationships with key players in the design ecosystem and top fab, assembly and test partners.

Renesas to acquire Transphorm to expand its power portfolio with GaN technology

Renesas and Transphorm, a global supplier of gallium nitride (GaN) power semiconductors, announced today that they have entered into a definitive agreement, according to which a Renesas subsidiary will acquire all of Transphorm’s outstanding common shares in cash at US$5.10 per share, representing a premium of approximately 35% to Transphorm’s closing price on January 10, 2024, a premium of approximately 56% to the volume weighted average price over the last twelve months and a premium of approximately 78% to the volume weighted average price over the last six months. The transaction values Transphorm at approximately $339 million.

The acquisition will provide Renesas with in-house GaN technology to expand its business in fast-growing markets such as electric vehicles, computing (data centers, artificial intelligence, infrastructure), renewable energy, industrial power, and fast chargers/adapters scope.

Infineon strengthens multi-sourcing strategy in new supplier agreement with SK Siltron CSS for silicon carbide (SiC) wafers

Infineon has signed an agreement with silicon carbide (SiC) supplier SK Siltron CSS for 150mm wafers. Under it, SK Siltron CSS will provide Infineon with 150mm SiC wafers and support its expansion into 200mm wafers. Infineon is building 200mm silicon carbide production lines in Villach, Austria, and Kulim, Malaysia, which are expected to start operations later this year. In addition, in order to expand the supply chain, Infineon has signed a multi-year supply and cooperation agreement with Resonac (formerly Showa Denko) for 150mm SiC wafers and transition to 200mm; it has also signed a 200mm wafer agreement with Coherent.

TSMC's Q4 revenue flat year-on-year but beats expectations

TSMC reported on Wednesday that revenue fell 8.4% year-on-year to T$176.3 billion, which was down 14.4% compared with the previous month. TSMC’s CFO and Spokesperson Wendell Huang said in a previous press conference that the revenue in U.S. dollars of Q42023 will be approximately 18.8 billion to 19.6 billion, with a gross profit margin of 51.5%~ 53.5%, operating profit rate 39.5%~41.5%. If calculated based on the exchange rate of 1 U.S dollar to NT$32, revenue in Q4 will fall between 601.6 billion and 607.2 billion yuan, an increase of 9% to 13% compared with the Q3. Therefore, the current Q4 revenue is better than originally expected.