2023 Latest Semiconductor News Released from May 21th to 27th

Joint Statement of the 2023 U.S.–Japan chip technology cooperation

The United States and Japan issued a joint statement saying that they will work together to formulate a roadmap for chip-related technologies and human resource development. The areas of cooperation also include artificial intelligence (AI), cybersecurity, and bio-related and quantum technologies.

During the Detroit meeting, they also affirmed the need to strengthen global supply chains with other partners and through multilateral engagement such as the Indo-Pacific Economic Framework, a U.S.-led economic initiative involving 14 countries in the region last year.

Nvidia's stock nears $1 trillion valuation

After Thursday's gain, Nvidia is worth $939.3 bln, while Chief Executive Jensen Huang saying the company was on track for a record year. Nvidia guided for sales of $11 billion in the Q1 2023, beating analysts' forecast of $7.15 billion, driven by demand for AI chips from data centers such as Google and Microsoft.

Micron overtakes SK Hynix in shrinking DRAM market

Micron surpassed Hynix for the first time in nine years to become the second largest manufacturer in the global DRAM market. Micron earned $2.72 billion in DRAM sales in the Q1 of 2023, down 8% from $2.83 bln in the previous quarter, but SK Hynix's sales for the same period fell 31.7% to $2.3 billion, according to Taiwanese market research firm TrendForce Corp on Thursday.

TSMC still in talks on possible German plant

TSMC is in talks to receive up to 50% of the German government's cost subsidies for building a new semiconductor factory in the country, Bloomberg reported.

And the government is in talks with TSMC and its project partners -- Bosch, NXP and Infineon. Because no final decision has been made, the subsidy amount is still subject to change. Any state aid must also be approved by the European Commission.

Xiaomi has been trying to develop its own chip business

In the conference call after the release of Xiaomi’s financial report held a few days ago, Lu Weibing, partner and president of Xiaomi Group, expressed a high degree of concern for chips and has been trying to self-develop the chip business.

At the same time, it is also said that we must fully realize the long-term and complexity of chip investment, respect the development laws of the chip industry, and prepare for a protracted war. In addition, the purpose of chips is to enhance the competitiveness and user experience of end products.

AMD Automotive introduces XA AU10P and XA AU15P for car csage

AMD introduced two new products in the automotive XA Artix+ UltraScale+ series. Both processors are automotive-qualified and optimized primarily for driver assistance system (ADAS) sensor applications. The cost-optimized Artix UltraScale+ devices expand AMD's portfolio of automotive-grade, functional safety-tested, highly scalable FPGAs and adaptive SoCs to complement the automotive-grade Spartan+ 7, Zynq+ 7000 and Zynq UltraScale+ product families.

XA Artix UltraScale+ processors are functional safety certified up to ASIL-B, which is critical for automotive ADAS sensors (from camera to LiDAR) and enables customers (automakers, robo-taxi developers and suppliers) ) accelerate the development of self-driving cars.s

Apple announces multibillion-dollar deal with Broadcom for U.S.-made chips

Apple said on Tuesday it had struck a multibillion-dollar deal with Broadcom to use U.S.-made chips. They will jointly develop 5G radio frequency components, which will be designed and manufactured at several factories in the United States, including Fort Collins, Colorado. After that, Broadcom shares rose 2.2 percent to hit a record high following the news.

Intel attempts to overtake TSMC

Intel CEO Pat Gelsinger pointed out on the 23rd that through three major strategies, including restarting the spirit of the Intel Developer Forum (IDF), establishing a rigorous R&D process (Tech Talk) and developing extreme ultraviolet light (EUV) technology, in cooperation with the transformation of IDM 2.0 will rebuild the innovation ecosystem, speed up and regain Intel's global leadership in products and technologies.

He expects to hold an investor webinar at the end of June to officially announce relevant info about the internal foundry model. And his foundry department ( IFS) plans to become the world's second largest wafer foundry in 2030, and attempts to overtake TSMC in a corner.

Intel will substitute silicon for glass to make substrates

Intel recently introduced its glass substrate technology at the APJ Packaging Roundtable technology event and said, "We plan to introduce quartz glass substrates in the second half of this decade, and hope this will continue to improve semiconductor performance."

Substrates made of glass, which have a smoother surface than plastic substrates, could potentially double the performance of high-performance chips. The substrate can also be more than a quarter thinner than previous designs, helping to reduce mounting area, and power consumption can also be halved compared to conventional models. Although the mass production of glass substrates may still be some time away, there are predictions that once realized, it will be a new game-changer for the substrate industry.

Portugal effectively bans Chinese companies from 5G

Portugal will ban the use of equipment from suppliers outside the European Union, or countries that are not part of NATO or the organization for Economic Co-operation and Development, in its 5G wireless network and the 4G platform on which the new technology is based.

Sino-US economic and trade relations will continue

US White House spokesman John Kirby said on the 24th that China's move against Micron will not undermine US efforts to improve relations between the two countries.

From May 25th to 26th, Minister of Commerce Wang Wentao will attend the APEC trade ministers meeting. During it, he will hold talks with US Secretary of Commerce Raimondo and Trade Representative Dai Qi respectively, and communicate with the US side on Sino-US economic and trade relations and issues of mutual concern.