Latest Semiconductor News Update on Jan 28 to Feb 3, 2024

Nubis and Alphawave to demo optical PCI Express 6.0 data centre technology

Nubis Communications, Inc. and Alphawave Semi announced today that they will demonstrate PCI Express 6.0 technology driving speeds of 64GT/s per lane over optical links. And data center providers are exploring the use of PCIe over Optics to dramatically expand the range and flexibility of memory, CPU, GPU and custom silicon accelerator interconnects for artificial intelligence (AI) and machine learning (ML/AI) architectures.

The Alphawave’s PCIe subsystem with PiCORE controller IP and PipeCORE PHY will drive and receive PCIe 6.0 traffic directly through the Nubis XT1600 linear optical engine, demonstrating PCIe 6.0 optical links at 64GT/s per fiber, and showing the high-speed optical probes.

U.S. plans to make significant investments in Vietnam's semiconductor sector

U.S. Under Secretary Jose W. Fernandez announced that it will invest in Vietnam’s semiconductor industry under the CHIPS and Science Act to diversify the supply chain and reduce dependence on China. According to reports, the move appears to be part of a $500 million global plan to strengthen semiconductor training, cybersecurity and business environments in seven target countries, including Vietnam.

As for Vietnam’s chip manufacturing, Intel's testing and assembly facilities near Ho Chi Minh City are critical to its global supply chain. In addition, Vietnam has many electronics assembly companies, so the country does consume a lot of chips and already plays an important role in the global electronics supply chain. And Fernandez believes that over time, Vietnam can develop its own semiconductor capabilities.

World's first n-type diamond MOSFET

Japan's National Institute of Materials Science (NIMS) recently announced the development of the world's first n-type diamond MOSFET. Its field effect mobility is approximately 150cm²/V·sec at 300°C, making diamond CMOS integrated circuits possible. The NIMS research team used its proprietary microwave plasma chemical vapor deposition (MPCVD) method to precisely control the doping concentration on the crystal plane of a high-temperature and high-pressure synthesis (HPHT) single-crystal diamond substrate to form a high-quality n-type diamond epitaxial layer.

The research team verified the operation of the fabricated MOSFETs. As a result, the drain current flowing between the source and drain (n+ layer) can be controlled by the voltage applied to the gate, and electronic (n-type) conductivity was confirmed from the polarity.

Teradyne pulled $1 billion worth of manufacturing from China

Teradyne, a supplier of semiconductor testing equipment, pulled manufacturing worth about $1 billion out of China after U.S. export regulations led to supply chain disruptions, a Teradyne spokesman said on Monday. Many U.S. companies have been trying to reduce their reliance on China in recent years as the U.S.-China tech war intensifies and regulators restrict trade in sensitive technologies such as chip manufacturing.

In addition, Teradyne warned investors in its 2022 annual report of the potential impact of the regulations in October, and said again in 2023 that the restrictions affected Teradyne's sales to certain companies in China and its manufacturing and development operations.

Intel Teams Up with UMC to develop 12nm chips for mobile, comms infra & networking

Intel and United Microelectronics Corporation (UMC), a top global semiconductor foundry, have divulged plans to collaborate on the development of a 12-nanometer semiconductor process platform to cope with the rapid growth of mobile, communication infrastructure and network markets. This long-term collaboration combines Intel's large-scale manufacturing capabilities in U.S. with UMC's extensive foundry experience in mature processes to expand the process portfolio while providing a better regionally diverse and resilient supply chain to assist global customers.

Taiwan, China, has always been an important member of Asia and the global semiconductor and extensive technology ecosystem. Intel is committed to cooperating with UMC, which is an important step towards Intel becoming the world's second largest wafer foundry by 2030.

White House to announce billions in subsidies for TSMC, Intel in March

The Biden administration is expected to award billions of dollars in subsidies to top semiconductor companies, including Intel and Taiwan Semiconductor Manufacturing Company, in the coming weeks to help build new factories in the United States, The Wall Street Journal reported Saturday. The subsidies are part of the $53 billion Chip Act, which aims to move the production of advanced chips to American soil and fend off China, which is rapidly developing its own chip industry. The chip bill includes $39 billion in manufacturing subsidies covering 15% of each project's total cost, up to $3 billion per fab, as well as loans, loan guarantees and tax credits. The grants to be announced are aimed at kick-starting manufacturing of advanced semiconductors, such as power smartphones, artificial intelligence (AI) and weapons systems.