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XCVC1702-2MLINSVG1369
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XCVC1702-2MLINSVG1369
XCVC1702-2MLINSVG1369
AMD
IC VERSAL AI-CORE FPGA 1369BGA
1369-FCBGA (35x35)
38139 In Stock
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Product Attributes
Type PARAMETERS
Categories
Integrated Circuits (ICs) , Embedded , System On Chip (SoC)
Supplier Device Package
1369-FCBGA (35x35)
Series
Versal™ AI Core
Primary Attributes
Versal™ AI Core FPGA, 1M Logic Cells
Product Status
Active
RAM Size
256KB
Connectivity
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Package / Case
1369-BFBGA, FCBGA
Number of I/O
500
Mfr
AMD
Architecture
MPU, FPGA
Flash Size
-
Speed
600MHz, 1.4GHz
Core Processor
Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Operating Temperature
-40°C ~ 110°C (TJ)
Package
Tray
Peripherals
DDR, DMA, PCIe
Documents & Media
RESOURCE TYPE LINK
Payment Method
Shipping
Quality Inspection
Packaging
1. All the products will be packed in ESD anti-static protection.

2. Outside ESD packing’s label will use our company’s information.

3. We will check all the goods before shipment to ensure that all products are in original and new condition.
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